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²ÛʽRCAÇåÏ´É豸

ÓÃÓÚÀ©É¢ºóµÄ¹èÆ¬È¥ÈÆ¶Æ¡¢ÇåÏ´´¦Àí¡£

É豸Ãû³Æ Equipment Name

²ÛʽRCAÇåÏ´É豸 Batch-type RCA Cleaning Equipment

É豸ÐͺŠEquipment Model

SC-CSZJ9600E-20F

É豸ÓÃ; Equipment Application

ÓÃÓÚÀ©É¢ºóµÄ¹èÆ¬È¥ÈÆ¶Æ¡¢ÇåÏ´´¦Àí¡£

Used for wrap around removal & cleaning of the diffused silicon wafers.

¹¤ÒÕÁ÷³Ì Process Flow

È¥ÈÆ¶Æ¡úºóÇåÏ´¡úËáÏ´¡úºóÇåÏ´¡úËáÏ´¡úÔ¤ÍÑË®¡úºæ¸É £¨¹©²Î¿¼£©  

Wrap Around Removal ¡ú Post-clean¡ú Acid Clean ¡ú Post-clean¡úAcid Clean¡ú Hot Water Drying ¡ú Drying (for reference)

¼¼ÊõÌØµã  Features

1¡¢²úÄÜ£º400Ƭ/Åú £¬9600Ƭ/Сʱ£¨210¹èƬ£©,480Ƭ/Åú £¬12000Ƭ/Сʱ£¨182¹èƬ£©¡£

Throughput: 400pcs/batch, 9600pcs/h(210mm wafer),480pcs/batch, 12000pcs/h (182mm wafer).

2¡¢Ö§³Ö¶àÖÖÌí¼Ó¼Á¼¼Êõ¡£

Various additive technologies available.

3¡¢Ö§³Ö×120¦Ìm¹èƬ¡£

Wafer thickness down to 120¦Ìm.

4¡¢½à¾»ÇøÓò¸ÉÔï £¬×Խྻϵͳ¡£

With dry clean area and self-cleaning system.

5¡¢¿ìËÙ»»Òº £¬ÔÚÏß»»Òº¡£

Quick inline bath change.

6¡¢Ö§³ÖMES¡¢RFID¼°Ñ¡ÅäÔÚÏß³ÆÖع¦Ð§¡£

Available with MES, RFID system, inline weight testing optional.


É豸²ÎÊý Parameters

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