É豸Ãû³Æ Equipment Name
²ÛʽRCAÇåÏ´É豸 Batch-type RCA Cleaning Equipment
É豸ÐͺŠEquipment Model
SC-CSZJ9600E-20F
É豸ÓÃ; Equipment Application
ÓÃÓÚÀ©É¢ºóµÄ¹èÆ¬È¥ÈÆ¶Æ¡¢ÇåÏ´´¦Àí¡£
Used for wrap around removal & cleaning of the diffused silicon wafers.
¹¤ÒÕÁ÷³Ì Process Flow
È¥ÈÆ¶Æ¡úºóÇåÏ´¡úËáÏ´¡úºóÇåÏ´¡úËáÏ´¡úÔ¤ÍÑË®¡úºæ¸É £¨¹©²Î¿¼£©
Wrap Around Removal ¡ú Post-clean¡ú Acid Clean ¡ú Post-clean¡úAcid Clean¡ú Hot Water Drying ¡ú Drying (for reference)
¼¼ÊõÌØµã Features
1¡¢²úÄÜ£º400Ƭ/Åú£¬9600Ƭ/Сʱ£¨210¹èƬ£©,480Ƭ/Åú£¬12000Ƭ/Сʱ£¨182¹èƬ£©¡£
Throughput: 400pcs/batch, 9600pcs/h(210mm wafer),480pcs/batch, 12000pcs/h (182mm wafer).
2¡¢Ö§³Ö¶àÖÖÌí¼Ó¼Á¼¼Êõ¡£
Various additive technologies available.
3¡¢Ö§³Ö×120¦Ìm¹èƬ¡£
Wafer thickness down to 120¦Ìm.
4¡¢½à¾»ÇøÓò¸ÉÔ×Խྻϵͳ¡£
With dry clean area and self-cleaning system.
5¡¢¿ìËÙ»»Òº£¬ÔÚÏß»»Òº¡£
Quick inline bath change.
6¡¢Ö§³ÖMES¡¢RFID¼°Ñ¡ÅäÔÚÏß³ÆÖع¦Ð§¡£
Available with MES, RFID system, inline weight testing optional.
É豸²ÎÊý Parameters