É豸Ãû³Æ Equipment Name

µ¥¾§²ÛʽÖÆÈÞÉ豸 Batch-type Mono-crystalline Texturing Equipment

É豸ÐͺŠEquipment Model

SC-CSZ12000F-16G

É豸ÓÃ; Equipment Application

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Used for texturing& cleaning of mono crystalline wafers.

¹¤ÒÕÁ÷³Ì Process Flow

È¥ËðÉË¡úÔ¤ÇåÏ´¡úµ¥¾§ÖÆÈÞ¡úºóÇåÏ´»òO3ÇåÏ´¡úËáÏ´¡úÔ¤ÍÑË®¡úºæ¸É£¨¹©²Î¿¼£©  

Saw damage removal¡úPre-cleaning¡úMono-texturing¡úPost-cleaning/O3 cleaning¡úAcid cleaning¡úHot water drying¡úDrying (for reference only)

¼¼ÊõÌØµã  Features

1¡¢²úÄÜ£º600Ƭ/Åú
£¬ 12000Ƭ/Сʱ¡ª¡ª210¹èƬ£¨100Ƭ»¨Àº£©£»720Ƭ/Åú
£¬15000Ƭ/Сʱ¡ª¡ª182¹èƬ£¨120Ƭ»¨Àº£©


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Throughput:600pcs/batch,12000pcs/h¡ª¡ª210 wafer(100pcs cassette),720pcs/batch,15000pcs/h¡ª¡ª182 wafer(120pcs cassette).

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Process bath circulation volume adjustable.

3¡¢ÖÆÈÞ½ð×ÖËþ¾ùÔÈ
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Uniform pyramids texture, etch depth adjustable.

4¡¢Ö§³Ö×120¦Ìm¹èƬ


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Wafer thickness handling capability up to 120¦Ìm.

5¡¢½à¾»¸ÉÔïÇøÓò
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With clean dry area and self-clean dry system.

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Low H2O2 consumption.

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Quick inline bath change.

8¡¢Ö§³ÖMES¡¢RFID¼°Ñ¡ÅäÔÚÏß³ÆÖع¦Ð§


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Available with MES, RFID system, inline weight testing optional.

É豸²ÎÊý Parameters