É豸Ãû³Æ Equipment Name

¹ÜʽA&PÉ豸  Horizontal PEALD (A&P)

É豸ÐͺŠEquipment Model

PD-520L/PD-520MAX

É豸ÓÃ; Equipment Application

AlO+SiN±¡Ä¤³Á»ý¡£
AlO+SiN Thin-film Deposition.

¼¼ÊõÌØµã  Features

1¡¢Ô­×Ó²ã³Á»ý¹¤ÒÕÌØÐÔ£¬³ÉĤ¾ùÔÈÐԺá£

Atomic layer deposition process, with better film uniformity.

2¡¢Í¬»ų́»òͬ¹ÜÍê³É¶à²ãĤ³Á»ý£¬¼õÉÙ¹¤ÒÕ»·½Ú£¬ÓÐЧÌáÉýÁ¼ÂÊ¡¢½µµÍËéƬÂÊ¡£
Multi-layer thin film deposited in the same process equipment or same furnace tube, reducing process steps and wafer breakage rate, improving yield effectively.

3¡¢×ÔÖ÷Ñз¢ÒºÌ¬Ô´Ç°ÇýÌåÕôÆøÊäËÍÓëÇ°ÇýÌå¿ìËÙÇл»¼¼Êõ¡£
Independent R&D of liquid source precursor vapor delivery and precursor rapid switching technology.

4¡¢ÊÊÓ¦²î±ðÇ°ÇýÌå¡¢²î±ðÖÊÁ϶ۻ¯²ã³Á»ý£¬¹¤ÒÕÍØÕ¹¿Õ¼ä´ó¡£
Suitable for deposition of passivation layer for different precursors and materials, with a large space for process expansion.

É豸²ÎÊý  Parameters