É豸Ãû³Æ Equipment Name

¹â×¢ÈëÍ˻刻Light Injection Annealing Furnace

É豸ÐͺŠEquipment Model

SC-LED05L/RA

É豸ÓÃ; Equipment Application

µ÷Àíµç³ØƬ·ÑÃ×Äܼ¶±ä¸ï£¬¿ØÖÆH×ÜÁ¿¼°¼Û̬£¬Ìá¸ßH¶Û»¯ÓëȱÏÝÐÞ¸´Ð§ÂÊ£¬µÖ´ï½µµÍPÐ͵ç³ØË¥¼õЧӦ£¬Ìá¸ßNÐ͵ç³Øת»»Ð§ÂʵÄЧ¹û¡£

By adjusting the Fermi energy level of the cell, controlling the total amount and valence state of H,improving the efficiency of H passivation and defect repair, to reduce the LID effect of P-type cells and improve the conversion efficiency of N-type cells.

¹¤ÒÕÁ÷³Ì  Process Flow

Ô¤ÈÈ¡ú¹â×¢Èë¡úÀäÈ´

Pre-heating ¡úLight Injection ¡úCooling

¼¼ÊõÌص㠠Features

1¡¢Ë«¹ì²úÏß£¬»ú¼ÜµçÆøÍêÈ«¶ÀÁ¢£¬»¥²»×ÌÈÅ¡£

Dual-track production line, the rack and electrical parts completely independent without interfering operations of each other.

2¡¢´ó²úÄÜ£ºÆ¥ÅäË¿Ó¡¹¤Ðò²úÄÜ£¬CT¡Ü0.80Ãë£¬»ùÓÚ¹èƬ³ß´çM10£¨18X¡À0.5mm*18X¡À0.5mm£©¡£
High throughput: match with the throughput of screen printing process, CT¡Ü0.80s,based on silicon wafer size M10 (18X¡À0.5mm*18X¡À0.5mm). 

É豸²ÎÊý  Parameters