É豸Ãû³Æ Equipment Name

²Ûʽ¼îÅ×¹âÇåÏ´É豸  Batch-type Alkaline Polishing Equipment

É豸ÐͺŠEquipment Model

SC-CSZJ9600E-15F

É豸ÓÃ; Equipment Application

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This equipment is used for polishing, etching and cleaning treatment of diffused wafers and also compatible for texturing and cleaning treatment of bifacial solar cells.

¹¤ÒÕÁ÷³Ì Process Flow

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Pre-cleaning¡úPolishing¡úPost-cleaning/ O3 cleaning¡úAcid cleaning¡úHot water drying¡úDrying (for reference only)

¼¼ÊõÌØµã  Features 

1. ²úÄÜ£º400Ƭ/Åú£¬9600Ƭ/Сʱ£¨210¹èƬ£©;480Ƭ/Åú£¬12000Ƭ/Сʱ£¨182¹èƬ£©¡£

Throughput: 400pcs/batch,9600pcs/h(210 wafer),480pcs/batch,12000pcs/h(182 wafer).

2. ¼æÈݱ³Ãæ¿ÌÊ´Å׹⼰µ¥¾§±³ÃæÖÆÈÞ¹¤ÒÕ¡£
Compatible with rear side etch polishing and mono-crystalline rear side texturing process.

3. Ö§³Ö¶àÖÖÌí¼Ó¼Á¼¼Êõ¡£
Suitable for various additives.

4. Ö§³Ö×120um¹èƬ¡£
Wafer thickness handling capability up to 120¦Ìm.

5. ½à¾»ÇøÓò¸ÉÔï£¬×Խྻϵͳ¡£
With dry clean area and self-cleaning system.

6. ¿ìËÙ»»Òº£¬ÔÚÏß»»Òº¡£
Quick inline bath change.

7. Ö§³ÖMES¡¢RFID¼°Ñ¡ÅäÔÚÏß³ÆÖع¦Ð§¡£
Suitable with MES, RFID system, inline weight testing optional.

É豸²ÎÊý Parameters